Semiconductor package having a thermally and electrically conductive spacer

A semiconductor package, comprising:

• a first substrate having a first metallized side;
• a first solder joint between the first metallized side of the first substrate and a semiconductor die at a first side of the semiconductor die, a second side of the semiconductor die opposite the first side being covered by a passivation, the passivation having an opening that exposes at least part of a pad at the second side of the semiconductor die;
• a second solder joint between a thermally and electrically conductive spacer and the part of the pad that is exposed by the opening in the passivation, the spacer having a plurality of sidewalls each of which is plated at least in a region where the second solder joint extends onto the sidewalls of the spacer;
• a second substrate having a first metallized side attached to the spacer at an opposite side of the spacer as the semiconductor die;
• and
• an encapsulant encapsulating the semiconductor die and the spacer.