Packaging method and package structure

A packaging method, comprising:

• providing a carrying board having a carrying surface;
• disposing a plurality of chips on the carrying surface of the carrying board, wherein each of the chips includes a first side connected to the carrying surface and a second side opposite to the first side, and the second side is provided with at least one chip connecting member;
• and
• providing a base structure and integrating the base structure, the chips, and the carrying board into a unitary structure under hot pressing conditions via an encapsulating material;
• wherein the base structure has a bonding surface provided with a plurality of predetermined regions for bonding the chips respectively, and each of the predetermined regions has at least one electrically connecting structure formed therein;
• wherein the at least one chip connecting member of each of the chips and the at least one electrically connecting structure in the corresponding one of the predetermined regions have a metal-to-metal bond formed therebetween and under the hot pressing conditions, the encapsulating material is formed into an encapsulating layer under the hot pressing conditions, and the encapsulating layer is located between the carrying board and the base structure to isolate the chips from the external environment.