Radio frequency package implementing a window frame with edge plating and processes of implementing the same

A process of implementing a radio frequency (RF) package, comprising:

• configuring a support having a semiconductor die attach region;
• providing at least one semiconductor die;
• configuring a frame comprising an electrically insulative member having a lower side attached to the support and an upper side opposite the support;
• configuring the frame to have an opening at least partially registered with said semiconductor die attach region;
• configuring the frame with an upper metallization having a first metallization and a second metallization at the upper side of the electrically insulative member and a lower metallization at the lower side of the electrically insulative member;
• arranging at least one discrete device on the upper metallization, the at least one discrete device being configured as a radio frequency component, and the at least one discrete device having terminals connected to the first metallization and the second metallization;
• and
• configuring the frame with an electrically conductive edge connection within the opening of the frame connecting the upper metallization to the lower metallization.