US 12,224,208 B2 · Method of separating electronic devices having a back layer and apparatus

Abstract

An apparatus for singulating a layer of material on a semiconductor substrate includes a chamber. The chamber is configured for supporting a semiconductor substrate attached to a carrier substrate, the semiconductor substrate can include a plurality of die formed as part of the semiconductor substrate and separated from each other by singulation lines and a layer of material disposed over a major surface of the semiconductor substrate. In some examples, the singulation lines terminate so that the layer of material extends over the singulation lines. The apparatus includes a pressure transfer vessel inside the chamber and a compression structure movably associated with the chamber. The compression structure can be configured so that the pressure transfer vessel is interposed between the semiconductor substrate and the compression structure. The compression structure and the pressure transfer vessel are adapted to apply pressure to the entire semiconductor substrate to singulate the layer of material that extends over the singulation lines.

Claims20

Dependent claims

An apparatus for singulating a layer of material on a semiconductor substrate comprising:

a compression chamber comprising a lower chamber wall, an upper chamber wall, and vertical sidewalls that extend upward from the lower chamber wall to the upper chamber wall;
wherein:
the vertical sidewalls bound the compression chamber on all sides to maintain pressure within the compression chamber;
the upper chamber wall comprises an opening extending through the upper chamber wall;
and
the lower chamber wall is configured for supporting a semiconductor substrate having a layer of material disposed on a major surface of the semiconductor substrate;
a bladder inside the compression chamber and comprising a bladder top side, a bladder lower side, and a bladder side extending between the bladder top side and the bladder lower side;
and
a compression plate within the compression chamber adjacent to the bladder top side, wherein:
the compression plate is mounted for movement in response to a downward pressure from a fluid introduced through the opening;
and
the compression plate is adapted to apply a controlled and substantially uniform pressure through the bladder towards the lower chamber wall.

9 more elements

An apparatus for singulating a layer of material on a semiconductor substrate comprising:

a compression chamber comprising a lower chamber wall, an upper chamber wall, and vertical sidewalls that extend upward from the lower chamber wall to the upper chamber wall;
wherein:
the vertical sidewalls bound the compression chamber on all sides to maintain pressure within the compression chamber;
and
the lower chamber wall is configured for supporting a semiconductor substrate having a layer of material disposed on a major surface of the semiconductor substrate;
a bladder inside the compression chamber and comprising a bladder top side, a bladder lower side, and a bladder side extending between the bladder top side and the bladder lower side;
and
a compression plate within the compression chamber adjacent to the bladder top side, wherein:
the compression plate moves in response to a fluid introduced into the compression chamber above the compression plate;
and
the compression plate is adapted to apply a substantially uniform pressure through the bladder towards the lower chamber wall.

8 more elements

An apparatus for singulating a layer of material on a singulated semiconductor substrate comprising:

a compression chamber comprising a lower chamber wall, an upper chamber wall, vertical sidewalls that extend upward from the lower chamber wall to the upper chamber wall, and an inlet;
wherein:
the vertical sidewalls bound the compression chamber on all sides to maintain pressure within the compression chamber;
and
the lower chamber wall is configured for supporting a semiconductor substrate having a layer of material disposed on a major surface of the semiconductor substrate;
a bladder inside the compression chamber and comprising a bladder top side, a bladder lower side, and a bladder side extending between the bladder top side and the bladder lower side;
and
a rigid compression plate within the compression chamber adjacent to the bladder top side, wherein:
the rigid compression plate is mounted for movement in unison with a downward pressure from a fluid introduced into the compression chamber through the inlet;
the rigid compression plate is adapted to compress the bladder downward towards the lower chamber wall;
and
the bladder side contacts the vertical sidewalls of the compression chamber.

9 more elements

Dependencies are inferred from the claim text.

Method of separating electronic devices having a back layer and apparatus

Life of this patent

Method of separating electronic devices having a back layer and apparatus

Life of this patent

Abstract

Claims20