Forming an oxide volume within a fin
AssigneeIntel Corporation
InventorsCheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron Lilak, Ehren Mannebach, Patrick Morrow, Anh Phan, Willy Rachmady, Hui Jae Yoo
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorsCheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron Lilak, Ehren Mannebach, Patrick Morrow, Anh Phan, Willy Rachmady, Hui Jae Yoo
Estimating the term…
Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes to form volumes of oxide within a fin, such as a Si fin. In embodiments, this may be accomplished by applying a catalytic oxidant material on a side of a fin and then annealing to form a volume of oxide. In embodiments, this may be accomplished by using a plasma implant technique or a beam-line implant technique to introduce oxygen ions into an area of the fin and then annealing to form a volume of oxide. Processes described here may be used manufacture a transistor, a stacked transistor, or a three-dimensional (3-D) monolithic stacked transistor.
An apparatus comprising:
A device comprising:
Dependencies are inferred from the claim text.