US 12,224,196 B2 · Semiconductor manufacturing apparatus, method of reading position of carrier, and method of attaching semiconductor die on carrier using semiconductor manufacturing apparatus

Abstract

A semiconductor manufacturing apparatus according to an embodiment includes a chuck configured to receive a carrier thereon, a carrier contact device configured to contact the carrier on the chuck, and a bonding head configured to transfer a semiconductor die to the carrier and configured to attach the semiconductor die on the carrier. The chuck includes a chuck reference key positioned at an edge portion thereof. The carrier contact device includes a contact position recognition key. The semiconductor manufacturing apparatus also includes a camera configured to obtaining images of the chuck reference key and the contact position recognition key.

Claims18

Dependent claims

A semiconductor manufacturing apparatus comprising:

a chuck configured to receive a carrier thereon, the chuck including a chuck reference key that is positioned at an edge portion thereof;
a carrier contact device, including a contact position recognition key, configured to contact the carrier on the chuck;
a bonding head configured to transfer a semiconductor die to the carrier and configured to attach the semiconductor die on the carrier;
and
a camera configured to obtain images of the chuck reference key and the contact position recognition key,
wherein the carrier contact device includes:
a plurality of push bars spaced apart from the chuck, capable of moving toward a center of the chuck on a plane that is parallel to the upper surface of the chuck;
and
the contact location recognition keys disposed on each of the plurality of push bars.

6 more elements

A method of reading a position of a carrier, the method comprising:

providing a chuck including a chuck reference key, the chuck reference key formed at an edge portion thereof;
positioning a carrier on the chuck;
fixing the carrier on the chuck by using a carrier contact device including a contact position recognition key;
and
reading the chuck reference key and the contact position recognition key to determine a position of the carrier on the chuck,
wherein fixing the carrier on the chuck comprises:
positioning at least one pair of push bars, each including the contact position recognition key, to face each other at opposite sides with respect to a center of the chuck, the at least one pair of push bars disposed to be spaced apart from the chuck;
and
fixing the at least one pair of push bars to the carrier by moving the at least one pair of push bars toward the center of the chuck.

6 more elements

A method of attaching a semiconductor die, the method comprising:

positioning a carrier on a chuck including a chuck reference key, the chuck reference key formed at an edge portion thereof;
transferring the semiconductor die to a predetermined position over the chuck reference key by using a bonding head including a bonding head reference key;
obtaining images of the chuck reference key and the bonding head reference key by using a camera;
reading a positional deviation of the bonding head reference key from the chuck reference key at the predetermined position, based on an image data of the images that are obtained by the camera;
and
correcting the read positional deviation and attaching the semiconductor die on the carrier,
wherein disposing the carrier on the chuck comprises reading the position of the carrier on the chuck,
wherein reading the position of the carrier comprises:
positioning the carrier on the chuck;
fixing the carrier on the chuck by using a carrier contact device including a contact position recognition key;
and
reading the chuck reference key and the contact position recognition key to determine the position of the carrier on the chuck,
wherein fixing the carrier on the chuck comprises:
positioning at least one pair of push bars, each including the contact position recognition key, to face each other at opposite sides with respect to a center of the chuck, the at least one pair of push bars disposed to be spaced apart from the chuck;
and
fixing the at least one pair of push bars to the carrier by moving the at least one pair of push bars toward the center of the chuck.

13 more elements

Dependencies are inferred from the claim text.

Facts

Application

17/374,737Filed 13 Jul 2021

Priority

KR 10-2020-01706998 Dec 2020

Published

US 2022/0181181 A19 Jun 2022

Granted

11 Feb 2025

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10P 72/53
For positioning, orientation or alignment: using optical controlling means
H10P 72/76
For supporting or gripping: using mechanical means, e.g. clamps or pinches
H10P 72/7608
The wafers being placed on a susceptor, stage or support: characterised by a plurality of separate clamping members, e.g. clamping fingers
H10P 72/78
For supporting or gripping: using vacuum or suction, e.g. Bernoulli chucks

Semiconductor manufacturing apparatus, method of reading position of carrier, and method of attaching semiconductor die on carrier using semiconductor manufacturing apparatus

Life of this patent

Semiconductor manufacturing apparatus, method of reading position of carrier, and method of attaching semiconductor die on carrier using semiconductor manufacturing apparatus

Life of this patent

Abstract

Claims18