Centering wafer for processing chamber
AssigneeApplied Materials, Inc.
InventorsMuhannad Mustafa, Sanjeev Baluja
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Materials, Inc.
InventorsMuhannad Mustafa, Sanjeev Baluja
Estimating the term…
Processing chambers, substrate supports, centering wafers and methods of center calibrating wafer hand-off are described. A centering wafer comprises a disc-shaped body having a top surface and a bottom surface defining a thickness, a center, an outer edge having an outer peripheral face, a first arc-shaped slit and a second arc-shaped slit. Embodiments of the disclosure advantageously provide the ability to use the centering wafer to monitor and control backside pressure and thereby determine the center of a substrate support prior to processing the centering wafer. The centering wafer may be centered at a plurality of different angles by rotating the centering wafer.
A centering wafer comprising:
Dependencies are inferred from the claim text.