Apparatus and method of brush cleaning using periodic chemical treatments

A chemical mechanical polishing (CMP) system, comprising:

• a first brush cleaner comprising:
• a first tank;
• and
• a first one or more scrubber brushes disposed in the first tank;
• a second brush cleaner comprising:
• a second tank;
• and
• a second one or more scrubber brushes disposed in the second tank;
• and
• a system controller that is configured to simultaneously control the first brush cleaner and the second brush cleaner to:
• rotate, during a first time duration of a cleaning cycle, the first one or more scrubber brushes while the first one or more scrubber brushes are in contact with a vertical first substrate disposed within the first tank and cause a substrate cleaning fluid from a supply pipe to be provided to the first substrate, the supply pipe configured to deliver the substrate cleaning fluid from a source to the first substrate;
• perform, concurrent with the rotating during the first time duration, a cleaning operation that comprises delivering a brush cleaning fluid from the supply pipe to of the second one or more scrubber brushes without a substrate disposed in the second tank, the supply pipe configured to receive the brush cleaning fluid from the source;
• perform, during a second time duration of the cleaning cycle, a cleaning operation that comprises delivering the brush cleaning fluid to the first one or more scrubber brushes without a substrate disposed in the first tank;
• and
• rotate, concurrent with the performing the cleaning operation during the second time duration, the second one or more scrubber brushes while the second one or more scrubber brushes are in contact with a vertical second substrate disposed in the second tank and cause the substrate cleaning fluid to be provided to the second substrate.