Method of manufacturing semiconductor device

A method of manufacturing semiconductor device comprising the steps of:

• providing a package including a first carrier, a seed layer, a plurality of wires, a die and a molding material, the seed layer is formed on the first carrier, the plurality of wires are formed on the seed layer, the die is bonded to the plurality of wires, and the die and the plurality of wires are covered by the molding material;
• disposing a second carrier on the molding material;
• removing the first carrier to expose the seed layer;
• removing the seed layer to expose the plurality of wires;
• and
• depositing a gold layer on each of the plurality of wires by immersion gold plating.