Fan out structure for light-emitting diode (LED) device and lighting system

A vehicle headlamp system comprising:

• a controller;
• a light emitting diode (LED) driver;
• and
• an active headlamp, communicatively coupled to the controller and electrically coupled to the LED driver, the active headlamp comprising a light device that comprises:
• a silicon backplane having a top surface, a bottom surface and side surfaces;
• an array of metal connectors on the top surface of the silicon backplane;
• a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces, and
• at least one first bond pad on the top surface of the substrate, the at least one first bond pad being electrically coupled to the array of metal connectors on the top surface of the silicon backplane.

A method of manufacturing a lighting device, the method comprising:

• molding a silicon backplane such that a molding material surrounds side surfaces of the silicon backplane to form a structure comprising a substrate with an embedded silicon backplane, the structure having a top surface, a bottom surface adjacent, and side surfaces;
• forming first bond pads on the top surface of the substrate;
• electrically coupling the bonds pads on the top surface of the substrate to the silicon backplane;
• forming an array of copper pillar bumps on the top surface of the silicon backplane;
• aligning an LED array with the array of metal connectors on the top surface of the silicon backplane, with a spacing between adjacent LEDs in the LED array being less than 20 μm;
• and
• applying heat to reflow the copper pillar bumps.