Laser-cut lead-frame for integrated circuit (IC) packages

A method for fabricating integrated circuit (IC) packages, the method comprising:

• fabricating a plurality of IC dies;
• providing a conductive metal material sheet;
• forming a lead-frame sheet from the conductive metal material sheet;
• coupling the IC dies to the lead-frame sheet;
• coupling the lead-frame sheet and the IC dies to packaging material to form an IC package block comprising the IC packages;
• and
• laser-cutting at least one groove in the packaging material and a respective lead-frame of each of the IC packages to electrically isolate portions of the lead-frame from each other.

An integrated circuit (IC) package comprising:

• an IC;
• a lead-frame having rectangular or square through-holes;
• and
• packaging material that substantially surrounds the IC and a portion of the lead-frame.