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US 12,224,180 B2Granted
Semiconductor device and a method of manufacturing a semiconductor device
AssigneeNexperia B.V.
InventorsRicardo Yandoc, Anthony Matthew, Manoj Balakrishnan, Adam Brown
Life of this patent
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Abstract
A semiconductor device including a clip, and the clip includes a clip slot, and a slug and the slug includes a groove. The clip and the slug are attached by the ultrasonic welding. The groove and the clip slot are at least partially overlapping to form a gas pathway.
Claims13
A semiconductor device comprising:
- a clip, wherein the clip comprises a clip slot;
- and
- a slug, wherein the slug comprises a groove on an underside of the slug that is encased by the top of the slug,
- wherein the groove and the clip slot are at least partially overlapping to form a gas pathway tunnel on the underside of the slug to an outside side of the slug.
1 more element
A method of producing a semiconductor device, the method comprising steps of:
- solder stencil printing to a die pad;
- attaching a die to the die pad;
- dispensing a solder on a top of the die;
- attaching a slug to a clip using ultrasonic welding,
- wherein the slug comprises a groove on an underside oft the slug that is encased by a top of the slug, and wherein the clip comprises a clip slot,
- wherein the groove and the clip slot are at least partially overlapping when attaching the slug to the clip to form a gas pathway tunnel on the underside of the slug a to an outside of the slug,
- wherein the groove is positioned on a side of the slug to which the slug is attached to the clip;
- and
- molding, PMC deflash and plating.
6 more elements
Dependencies are inferred from the claim text.