Method for forming fin structure in fin field effect transistor process and fin structure
AssigneeShanghai Huali Integrated Circuit Corporation
InventorXiaobo Guo
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AssigneeShanghai Huali Integrated Circuit Corporation
InventorXiaobo Guo
Estimating the term…
The application discloses a method for forming a fin structure in a fin field effect transistor process, which includes: performing photolithography and etching for a first time to form a first core layer pattern and a second core layer pattern, and depositing an etching mask layer; etching back the etching mask layer to form sidewalls of the first core layer pattern and sidewalls of the second core layer pattern; performing photolithography for a second time; etching the substrate for a first time to form fins and a planar active area consisting of a substrate material; removing sidewalls of a first photoresist pattern, a second photoresist pattern and the second core layer pattern, and reserving the second core layer pattern; performing photolithography for a third time; etching the substrate for a second time to form reference layer overlay mark and a fin cut area consisting of the substrate material.
A method for forming a fin structure in a fin field effect transistor process, comprising:
Dependencies are inferred from the claim text.