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US 12,224,161 B2Granted
Low temperature manifold assembly for substrate processing systems
AssigneeLam Research Corporation
InventorGabriel De Jesus Soto
Life of this patent
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AssigneeLam Research Corporation
InventorGabriel De Jesus Soto
Estimating the term…
A manifold assembly for a processing chamber in a substrate processing system includes a manifold. The manifold includes a first valve assembly configured to flow a liquid coolant at a first temperature from a first channel of a coolant assembly to the processing chamber. The first valve assembly is configured to flow the liquid coolant at a cryogenic temperature. The manifold further includes a first weldment block including tubing associated with the first valve assembly, a second valve assembly configured to flow the liquid coolant at a second temperature greater than the first temperature from a second channel of the coolant assembly to the processing chamber, and a second weldment block including tubing associated with the second valve assembly. An insulative housing enclosing the first valve assembly, the first weldment block, and the second weldment block. The insulative housing is comprised of a plurality of layers of an insulative material.
A manifold assembly for a processing chamber in a substrate processing system, the manifold assembly comprising:
A temperature control system for a processing chamber configured to perform cryogenic etching, the temperature control system comprising:
Dependencies are inferred from the claim text.