Embedded substrate, circuit board assembly, and electronic device

A circuit board assembly, comprising a circuit board and an embedded substrate including an insulation layer, an electronic element, and a conductive connector,

• wherein the electronic element and the conductive connector are embedded inside the insulation layer, the conductive connector is electrically connected to the electronic element, and the conductive connector comprises an external connection end for transmitting an electrical signal to the electronic element;
• the conductive connector comprises at least one fuse unit, each of the at least one fuse unit comprises a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a current threshold, to disconnect an electrical connection between the electronic element and the external connection end;
• and
• the embedded substrate is disposed on the circuit board, and the external connection end of the conductive connector is electrically connected to the circuit board,
• wherein the insulation layer comprises a first insulation layer and a second insulation layer that are disposed in stacked manner, and the second insulation layer comprises a hollow area;
• and the electronic element and the conductive connector are embedded in the first insulation layer, the at least one fuse unit is located on a surface, of the first insulation layer, that faces the second insulation layer, and the at least one fuse unit is exposed in the hollow area.

An electronic device, comprising a circuit board assembly including a circuit board and an embedded substrate, wherein the embedded substrate comprises an insulation layer, an electronic element, and a conductive connector, the electronic element and the conductive connector are embedded inside the insulation layer, the conductive connector is electrically connected to the electronic element, and the conductive connector comprises an external connection end for transmitting an electrical signal to the electronic element;

• the conductive connector comprises at least one fuse unit, each of the at least one fuse unit comprises a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a current threshold, to disconnect an electrical connection between the electronic element and the external connection end;
• and
• the embedded substrate is disposed on the circuit board, and the external connection end of the conductive connector is electrically connected to the circuit board,
• wherein the insulation layer comprises a first insulation layer and a second insulation layer that are disposed in a stacked manner, and the second insulation layer comprises a hollow area;
• and the electronic element and the conductive connector are embedded in the first insulation layer, the at least one fuse unit is located on a surface, of the first insulation layer, that faces the second insulation layer, and the at least one fuse unit is exposed in the hollow area.