Multilayer electronic component

A method for manufacturing a multilayer electronic component comprising a body including a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction, and an external electrode disposed outside the body and connected to the internal electrode, the method comprising:

• a printing process including:
• a process of forming a cover portion pattern by printing a first ceramic slurry including a first dielectric material and a fluorine-based compound, and
• at least one of:
• a process of forming a dielectric pattern by printing a second ceramic slurry including a second dielectric material, and
• a process of forming an internal electrode pattern by printing a conductive paste for the internal electrode including a conductive particle for the internal electrode;
• forming a stack body including the cover portion pattern, the dielectric pattern, and the internal electrode pattern;
• a sintering process of sintering the stack body to obtain the body;
• and
• a process of forming the external electrode outside the body,
• wherein the first dielectric material includes BaTiO3 as a main component, and an amount of a fluorine-based compound included in the first ceramic slurry is 0.2 to 1.0 parts by weight, relative to 100 parts by weight of BaTiO3.