Multilayer electronic component

A multilayer electronic component, comprising:

• a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other a third direction;
• a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a portion of the first surface;
• a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a portion of the first surface;
• an insulating layer disposed on the second surface and extending to a portion on the first and second connection portions;
• and
• a plating layer disposed on the first band portion
• wherein the plating layer is in contact with the insulating layer on the first external electrode, and
• wherein an end of the plating layer includes a first area disposed between the insulating layer and the first and second external electrode, and a second area disposed to cover at least a portion of the insulating layer,
• wherein an end of the insulating layer extends from a portion of an inner surface of the insulating layer which contacts the first external electrode to a region between the first area and the second area, and is farther from the body than the portion of the inner surface of the insulating layer which contacts the first external electrode.