Electronic component

An electronic component comprising:

• an electronic element;
• and
• an interposer board;
• wherein
• the electronic element includes:
• a multilayer body including dielectric layers and internal electrode layers which are alternately laminated, a pair of multilayer body end surfaces orthogonal or substantially orthogonal to the internal electrode layers, a pair of multilayer body side surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces, and a pair of multilayer body main surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces and the multilayer body side surfaces;
• and
• external electrodes each on a respective one of the pair of multilayer body end surfaces of the multilayer body and connected to the internal electrode layers;
• the interposer board includes a pair of board end surfaces, a pair of board side surfaces orthogonal or substantially orthogonal to the board end surfaces, and a pair of board main surfaces orthogonal or substantially orthogonal to the board end surfaces and the board side surfaces;
• one of the pair of board main surfaces is joined with one of the pair of multilayer body main surfaces or one of the pair of multilayer body side surfaces;
• the external electrodes include a first Cu layer, a first Ni plated layer, and a first Sn plated layer;
• a second Cu layer is located on the interposer;
• a second Ni plated layer is located on the second Cu layer;
• a second Sn plated layer is located on the Ni plated layer;
• the interposer board is an alumina board;
• the first Ni plated layer is spaced from the second Ni plated layer;
• a third Sn plated layer is located between the first Ni plated layer and the first Sn plated layer;
• and
• the first Sn plated layer is located on the third Sn plated layer and the second Sn plated layer.