Composite electronic component

A composite electronic component, comprising:

• a substrate having a GND pattern;
• a coil component having at least three terminals and mounted on a first surface of the substrate;
• and
• an overlapping arrangement component that is an electronic component having a height lower than that of the coil component and that is mounted on the first surface so that at least a part of the overlapping arrangement component overlaps the coil component when viewed from a first direction perpendicular to the first surface,
• wherein the substrate has at least three coil connection patterns formed on the first surface and connected to the terminals, at least two component connection patterns formed on the first surface and connected to the overlapping arrangement component, and a GND via electrically connecting one of the component connection patterns and the GND pattern to each other, and
• the GND via is arranged in a substrate outer region, which is outside a region of a hypothetical polygon connecting all of the coil connection patterns on the substrate with a shortest perimeter, when viewed from the first direction.