Conductive paste and electronic device

A conductive paste, comprising:

• a base resin, a solvent, a conductive filler, a curing agent, and an auxiliary agent,
• wherein the base resin is a mixture of epoxy resin and polyurethane, a weight percentage of the epoxy resin in the base resin is greater than or equal to 50%, and the epoxy resin limits the polyurethane in a structure formed by curing of the base resin
• wherein the conductive paste further comprises a low-molecular weight polyol,
• wherein the curing agent is blocked polyisocyanate, and the polyurethane, the low-molecular weight polyol, and the blocked polyisocyanate are reacted during a heat curing process to form a flexible three-dimensional net structure;
• and
• wherein the conductive paste comprises 3 wt % to 15 wt % of the base resin, 5 wt % to 20 wt % of the solvent, 60 wt % to 85 wt % of the conductive filler, 3 wt % to 15 wt % of the low-molecular weight polyol, 3 wt % to 10 wt % of the blocked polyisocyanate, and 0.2 wt % to 10 wt % of the auxiliary agent.