Heat sinks for bare die multi-chip packages
AssigneeAmazon Technologies, Inc.
InventorsAli Elashri, William Mark Megarity, Ryan F Conroy, Chetan Sanjay Agarwal, Priti Choudhary
Life of this patent
Estimating the term…
Abstract
Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.
Claims13
A processor mounting system, comprising:
- a bare die processor;
- and
- a mounting structure for the bare die processor, the mounting structure comprising:
- an upper plate comprising:
- a lower surface configured to be positioned proximate an upper surface of the bare die processor;
- and
- a heat transfer portion configured to transfer heat conducted to the upper plate from the bare die processor to a cooling fluid in fluid communication with the heat transfer portion;
- a lower plate positioned on an opposite side of the bare die processor from the upper plate, wherein the lower plate includes a plurality of posts positioned along edges of the lower plate, wherein the plurality of posts include protruding portions from an upper surface of the upper plate when assembled in the mounting structure, the protruding portions having notches;
- and
- a bracket configured to be positioned on the upper surface of the upper plate, wherein:
- the bracket includes a central portion and legs extending towards the protruding portions of the plurality of posts when coupled to the upper surface of the upper plate,
- the bracket is configured to engage with the upper surface of the upper plate at the central portion,
- end portions of the legs are configured to simultaneously engage with the plurality of posts,
- slots in the end portions of the legs are configured to simultaneously engage with notches in the plurality of posts as the legs are pushed downwards such that the legs and the central portion of the bracket provide a balanced downward force on the upper plate, and
- the slots are stepped between a first position and a second position, wherein, in the first position, the slots are able to fit over the plurality of posts, and wherein, in the second position, the slots engage with the notches.
A mounting system, comprising:
- an upper plate comprising:
- a lower surface configured to be positioned proximate an upper surface of a processor;
- and
- a heat transfer portion configured to transfer heat conducted to the upper plate from the processor to a cooling fluid in fluid communication with the heat transfer portion;
- a plurality of posts having protruding portions from along edges of an upper surface of the upper plate when assembled in the mounting structure;
- a bracket configured to be positioned on the upper surface of the upper plate, wherein the bracket includes a central portion configured to engage with the upper surface of the upper plate such that the bracket provides a centralized downward force on the upper plate in an installed position;
- and
- a lower plate configured to be positioned on an opposite side of the processor from the upper plate, wherein the lower plate includes the plurality of posts, wherein the bracket includes legs extending towards the protruding portions of the plurality of posts when coupled to the upper surface of the upper plate, and wherein slots in end portions of the legs are configured to simultaneously engage with notches in the plurality of posts as the legs are pushed downwards such that the legs and the central portion of the bracket provide the centralized downward force on the upper plate, and wherein the slots are stepped between a first position and a second position, wherein, in the first position, the slots are able to fit over the plurality of posts, and wherein, in the second position, the slots engage with the notches.
A method, comprising:
- positioning an upper plate on a processor, wherein the upper plate comprises:
- a lower surface configured to be positioned proximate an upper surface of the processor;
- and
- a heat transfer portion configured to transfer heat conducted to the upper plate from the processor to a cooling fluid in fluid communication with the heat transfer portion;
- wherein a plurality of posts include protruding portions from an upper surface of the upper plate along edges of the upper plate, and wherein a lower plate includes the plurality of posts;
- positioning a bracket on the upper surface of the upper plate, wherein the bracket includes a central portion that engages with the upper surface of the upper plate and includes legs extending towards the protruding portions of the plurality of posts when engaged with the upper surface of the upper plate, and wherein slots in end portions of the legs are configured to simultaneously engage with notches in the plurality of posts as the legs are pushed downwards such that the legs and the central portion of the bracket provide the centralized downward force on the upper plate, and wherein the slots are stepped between a first position and a second position, wherein, in the first position, the slots are able to fit over the plurality of posts, and wherein, in the second position, the slots engage with the notches;
- and
- securing the bracket to the upper surface of the upper plate, wherein a centralized downward force is provided on the upper plate as the bracket is secured to the upper plate, and wherein securing the bracket to the upper surface of the upper plate includes securing the bracket to one or more of the plurality of posts.
Dependencies are inferred from the claim text.