LIDAR sensor system including integrated modulator

An autonomous vehicle control system, comprising:

• a photonics integrated circuit (PIC), the PIC comprising:
• a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices directly formed on the substrate, the two or more semiconductor devices configured to receive a beam from a light source and modify the beam, the two or more semiconductor devices comprising:
• a first modulator configured to output a transmit signal configured to interact with an object in an environment, wherein the transmit signal is configured to generate a returned signal in response to interaction with the object in the environment;
• and
• a second modulator configured to output a local signal, wherein the local signal and the returned signal are configured to be mixed to generate a down-converted signal;
• and
• at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die.

An autonomous vehicle, comprising:

• an autonomous vehicle control system, the autonomous vehicle control system comprising one or more processors;
• and
• a light detection and ranging (LIDAR) system, the LIDAR system comprising:
• a light source configured to output a beam;
• a photonics integrated circuit (PIC) comprising:
• a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices formed on the substrate, the two or more semiconductor devices configured to receive the beam from the light source and modify the beam, the two or more semiconductor devices comprising:
• a first modulator configured to output a transmit signal configured to interact with an object in an environment, wherein the transmit signal is configured to generate a returned signal in response to interaction with the object in the environment;
• and
• a second modulator configured to output a local signal;
• and
• at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die;
• and
• one or more optics configured to receive the beam from the transmitter and emit the beam towards the object in the environment of the autonomous vehicle.