Contact pins for test sockets and test sockets comprising the same

A test socket for testing electrical characteristics of a semiconductor device, comprising:

• a housing, wherein a plurality of first through-holes are formed in the housing;
• a cover, wherein a plurality of second through-holes are formed in the cover;
• and
• a plurality of contact pins, wherein the plurality of contact pins are inserted into the plurality of first through-holes and the plurality of second through-holes,
• wherein the plurality of contact pins comprise:
• an elastic part, wherein the elastic part is elastically deformable in a longitudinal direction of the contact pin;
• a first contact part, wherein the first contact part comprises a first support part extending from a first end of the elastic part and a first contact tip connected to an end of the first support part, and the first contact part is inserted into the plurality of first through-holes;
• and
• a second contact part, wherein the second contact part comprises a second support part extending from a second end of the elastic part and a second contact tip connected to an end of the second support part, and the second contact part is inserted into the plurality of second through-holes,
• wherein the elastic part and the second contact part are bent in at least one direction with respect to the first contact part before the plurality of contact pins are inserted into the plurality of second through-holes.