System and method for the acoustic detection of cracks in a semiconductor substrate

A method for the acoustic detection of cracks in a semiconductor substrate, the method comprising:

• pressing down onto a semiconductor substrate with a force generating unit and thereby applying a force onto the semiconductor substrate;
• contacting the semiconductor substrate with a resonating indenter of a detector unit separate from the force generating unit, the detector unit further comprising an acoustic emission sensor coupled to the resonating indenter;
• and
• evaluating with an evaluation unit acoustic signals detected by the detector unit and determining, whether a crack has occurred based on the detected signals,
• wherein the resonating indenter is configured to contact the semiconductor substrate at a lateral distance from the force generating unit, and
• wherein the force generating unit and the resonating indenter are configured to contact the semiconductor substrate on the same side.