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US 12,222,222 B2Granted
Sensor cover and sensor module
AssigneeAGC Inc.
InventorsKazuya Takemoto, Atsushi Koyanagi, Naoto Tatsuoka
Life of this patent
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Abstract
A sensor cover, provided in an opening of a housing that houses a sensor, includes a conductor; a dielectric multilayer film; and a heating film, in a desired order from an outside of the housing toward an inside of the housing. The conductor and the heating film are insulated from each other. A shortest distance between the conductor and the heating film is 2.0 μm or more.
Claims11
A sensor cover positioned in an opening of a housing that houses a sensor, the sensor cover comprising:
- a conductor;
- a dielectric multilayer film;
- and
- a heating film, the conductor, the dielectric multilayer film, and the heating film being positioned in a predetermined order from an outside of the housing toward an inside of the housing,
- wherein the conductor is a substrate which comprises a conductive material and has a thickness of 0.1 mm or more,
- the conductor and the heating film are insulated from each other,
- the conductor is electrically connected to a ground, and
- a shortest distance between the conductor and the heating film is 2.0 μm or more.
5 more elements
Dependencies are inferred from the claim text.