Antenna encapsulation
AssigneeX-Celeprint Limited
InventorRonald S. Cok
Life of this patent
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AssigneeX-Celeprint Limited
InventorRonald S. Cok
Estimating the term…
A micro-module includes a module substrate, an antenna having antenna walls and an antenna top surface disposed on or over the module substrate, and a sealant disposed on the module substrate surface and on at least a portion of the antenna walls. The sealant extends to at least the antenna top surface. The antenna walls and sealant form an enclosed area of the module substrate surface surrounded by the antenna walls and sealant. A module circuit is disposed on or in the module substrate in the enclosed area. The module circuit is electrically connected to the antenna and is responsive to electrical signals received from the antenna. A cap is disposed on or over the antenna top surface and the sealant, encapsulating the module circuit.
A micro-module, comprising:
A micro-module, comprising:
A micro-module, comprising:
Dependencies are inferred from the claim text.