Packaged white light emitting device comprising photoluminescence layered structure

A light emitting device comprising:

• a substrate;
• a first Chip Scale Packaged (CSP) Light Emitting Diode (LED) for generating light of a first color temperature;
• and
• a second CSP LED for generating light of a second color temperature;
• wherein the first and the second CSP LEDs each comprise:
• a respective LED chip for generating light with a dominant wavelength from 440 nm to 470 nm;
• a respective first photoluminescence layer that at least partially covers a light emitting face of the LED chip, said first photoluminescence layer comprising at least 75 weight percent (wt %) of a manganese-activated fluoride photoluminescence material of a total photoluminescence material content of the first photoluminescence layer;
• and
• a respective second photoluminescence layer comprising a photoluminescence material for generating light with a peak emission wavelength from 500 nm to 650 nm, wherein the second photoluminescence layer covers the first photoluminescence layer;
• and
• wherein the first CSP LED and the second CSP LED are mounted on the substrate.