Semiconductor device and solid-state image sensor including pixel substrate joined with another substrate
AssigneeSony Semiconductor Solutions Corporation
InventorYosuke Nitta
Life of this patent
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Abstract
A semiconductor device includes a first substrate which is individualized and includes a first semiconductor circuit (LOG) including a first terminal, and a second substrate which includes a second semiconductor circuit (PIX) including a second terminal. The first terminal and the second terminal are joined. The second substrate includes a first insulating layer that is arranged above the second substrate, and a second insulating layer that is arranged at least partially above the first insulating layer and in which the second terminal is arranged.
Claims20
A semiconductor device, comprising:
- a first substrate including a first semiconductor circuit, wherein
- the first semiconductor circuit includes a first terminal, and
- the first substrate is individualized into a first chip;
- and
- a second substrate including a second semiconductor circuit, wherein
- the second semiconductor circuit includes a second terminal,
- the first terminal is joined to the second terminal,
- the second substrate further includes:
- a first insulating layer between the second substrate and the first substrate;
- and
- a second insulating layer between the first insulating layer and the first substrate,
- the second terminal is in the second insulating layer,
- the second terminal is between the first insulating layer and the first terminal, and
- the second terminal faces the second substrate.
A semiconductor device, comprising:
- a first substrate including a first semiconductor circuit, wherein
- the first semiconductor circuit includes a first terminal, and
- the first substrate is individualized into a chip;
- and
- a second substrate including a second semiconductor circuit, wherein
- the second semiconductor circuit includes a second terminal,
- the first terminal is joined to the second terminal,
- the second substrate further includes:
- a joining surface joined to the first substrate;
- a non-joining surface on a side of the second substrate;
- a first insulating layer between the second substrate and the first substrate;
- and
- a second insulating layer between the first insulating layer and the first substrate,
- the non-joining surface is opposite to the joining surface,
- the first insulating layer is a stopper layer,
- the second insulating layer includes a third terminal, and
- the third terminal is electrically isolated from the second semiconductor circuit.
A solid-state image sensor, comprising:
- at least one of a logic substrate which includes a logic circuit or a memory substrate which includes a memory circuit, wherein
- the logic circuit includes a first terminal,
- the memory circuit includes a third terminal, and
- the at least one of the logic substrate or the memory substrate is individualized to a chip;
- and
- a pixel substrate which includes a pixel circuit, wherein
- the pixel circuit includes a second terminal,
- at least one of the first terminal or the third terminal is joined to the second terminal,
- the pixel substrate further includes:
- a first insulating layer between the pixel substrate and the at least one of the logic substrate or the memory substrate;
- and
- a second insulating layer between the first insulating layer and the at least one of the logic substrate or the memory substrate,
- the second terminal is in the second insulating layer,
- the second terminal is between the first insulating layer and the first terminal, and
- the second terminal faces the pixel substrate.
Dependencies are inferred from the claim text.