Structure and method for gate-all-around metal-oxide-semiconductor devices with improved channel configurations
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJhon Jhy Liaw
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJhon Jhy Liaw
Estimating the term…
The present disclosure provides an integrated circuit device that comprises a semiconductor substrate having a top surface; a first and a second source/drain features over the semiconductor substrate; a first semiconductor layer extending in parallel with the top surface and connecting the first and the second source/drain features, the first semiconductor layer having a center portion and two end portions, each of the two end portions connecting the center portion and one of the first and second source/drain features; a first spacer over the two end portions of the first semiconductor layer; a second spacer vertically between the two end portions of the first semiconductor layer and the top surface; and a gate electrode wrapping around and engaging the center portion of the first semiconductor layer. The center portion has a thickness smaller than the two end portions.
A device structure, comprising:
A semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.