Three-dimensional semiconductor device and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSungil Park, Jae Hyun Park, Daewon Ha, Kyuman Hwang
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Electronics Co., Ltd.
InventorsSungil Park, Jae Hyun Park, Daewon Ha, Kyuman Hwang
Estimating the term…
Provided is a three-dimensional semiconductor device and its fabrication method. The semiconductor device includes a first active region on a substrate and including a plurality of lower channel patterns and a plurality of lower source/drain patterns that are alternately arranged along a first direction, a second active region on the first active region and including a plurality of upper channel patterns and a plurality of upper source/drain patterns that are alternately arranged along the first direction, a first gate electrode on a first lower channel pattern of the lower channel patterns and on a first upper channel pattern of the upper channel patterns, and a second gate electrode on a second lower channel pattern of the lower channel patterns and on a second upper channel pattern of the upper channel patterns. The second gate electrode may include lower and upper gate electrodes with an isolation pattern interposed therebetween.
A three-dimensional semiconductor device, comprising:
A three-dimensional semiconductor device, comprising:
A three-dimensional semiconductor device, comprising:
Dependencies are inferred from the claim text.