Chip parts
AssigneeRohm Co., Ltd.
InventorKeisuke Fukae
Life of this patent
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AssigneeRohm Co., Ltd.
InventorKeisuke Fukae
Estimating the term…
The present disclosure provides a chip part. The chip part includes a substrate, a first external electrode, a second external electrode, a capacitor portion, a lower electrode, a capacitive film and an upper electrode. The first external electrode and the second external electrode are disposed on a first main surface of the substrate. The capacitor portion is disposed on the first main surface of the substrate. The lower electrode includes a first body portion and a first peripheral portion integrally drawn out around the capacitor portion from the first body portion. The capacitive film includes a second body portion disposed within the capacitor portion and a second peripheral portion integrally drawn out from the second body portion to the first peripheral portion. The upper electrode is disposed on the capacitive film.
A chip part, comprising:
Dependencies are inferred from the claim text.