Method of forming package structure and package structure therefrom
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
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Abstract
A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.
Claims20
A method of forming a package structure, comprising:
- providing a semiconductor structure having a photonic element region;
- electrically bonding a semiconductor die to the semiconductor structure;
- forming a polymeric wall structure on the semiconductor structure and laterally aside the semiconductor die, wherein the polymeric wall structure is ring-shaped with a through hole defined by inner sidewalls of the polymeric wall structure, and the through hole exposes the photonic element region of the semiconductor structure;
- forming a filling material to fill the through hole within the wall structure;
- forming an encapsulant laterally wrapping around the semiconductor die, the polymeric wall structure and the filling material;
- and
- removing the filling material to reveal the through hole.
A method of forming a package structure, comprising:
- providing a semiconductor structure having a photonic element region and vias therein;
- electrically bonding a semiconductor die to the semiconductor structure;
- forming a polymeric wall on the semiconductor structure, above the photonic element region, and beside the semiconductor die, wherein the polymeric wall defines a through hole exposing the semiconductor structure;
- forming a filling material to fill up the through hole;
- forming an insulating encapsulant on the semiconductor structure to encapsulate the semiconductor die, the polymeric wall and the filling material;
- performing a thinning process to a backside of the semiconductor structure until the vias are exposed to form through semiconductor vias (TSVs);
- forming a redistribution structure on the thinned semiconductor structure and on the TSVs;
- performing a singulation process to the redistribution structure and the thinned semiconductor structure;
- and
- removing the filling material.
A package structure, comprising:
- a first die including at least a photonic element;
- a second die electrically bonded to the first die;
- a wall structure, disposed on the first die and laterally aside the second die, wherein the wall structure defines a through hole exposing the at least photonic element;
- an optical element disposed on the first die and inside the through hole of the wall structure, wherein the optical element is optically coupled with the at least one photonic element;
- and
- an encapsulant laterally wrapping around the second die and the wall structure.
Dependencies are inferred from the claim text.