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US 12,218,114 B2Granted
Semiconductor device and method of making a photonic semiconductor package
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsKyungOe Kim, YoungCheol Kim, HeeSoo Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor device has an interposer. A first semiconductor die with a photonic portion is disposed over the interposer. The photonic portion extends outside a footprint of the interposer. The interposer and first semiconductor die are disposed over a substrate. An encapsulant is deposited between the interposer and substrate. The photonic portion remains exposed from the encapsulant.
Claims13
A method of making a semiconductor device, comprising:
- providing an interposer;
- disposing a first semiconductor die over the interposer with a portion of the first semiconductor die extending over a fourth edge of the interposer and outside a footprint of the interposer;
- disposing a first PCB unit over the interposer adjacent to a first edge of the first semiconductor die and between the first edge of the first semiconductor die and a first edge of the interposer in plan view;
- disposing a second PCB unit over the interposer adjacent to a second edge of the first semiconductor die and between the second edge of the first semiconductor die and a second edge of the interposer in plan view, wherein the second edge of the first semiconductor die is perpendicular to the first edge of the first semiconductor die;
- disposing a third PCB unit over the interposer adjacent to a third edge of the first semiconductor die and between the third edge of the first semiconductor die and a third edge of the interposer in plan view, wherein the first semiconductor die is directly between the first PCB unit and third PCB unit;
- disposing the interposer and first semiconductor die over a substrate with the first semiconductor die, first PCB unit, second PCB unit, and third PCB unit between the interposer and substrate;
- disposing a first solder bump between the interposer and first PCB unit;
- and
- disposing a second solder bump between the first PCB unit and substrate.
6 more elements
A semiconductor device, comprising:
- an interposer;
- a first discrete passive component disposed on a first surface of the interposer;
- a first portion of solder extending from the first discrete passive component to a first contact pad of the interposer;
- a second discrete passive component disposed on a second surface of the interposer;
- a second portion of solder extending from the second discrete passive component to a second contact pad of the interposer;
- a first semiconductor die disposed over the first surface of the interposer with a photonic portion of the first semiconductor die extending outside a footprint of the interposer;
- a second semiconductor die disposed over the second surface of the interposer;
- a substrate disposed with the first semiconductor die between the interposer and substrate;
- a first PCB unit disposed between the substrate and interposer adjacent to a first edge of the first semiconductor die and between the first edge of the first semiconductor die and a first edge of the interposer in plan view, wherein the first discrete passive component is physically directly between the first PCB unit and the first semiconductor die;
- a second PCB unit disposed between the substrate and interposer adjacent to a second edge of the first semiconductor die and between the second edge of the first semiconductor die and a second edge of the interposer in plan view, wherein the second edge of the first semiconductor die is perpendicular to the first edge of the first semiconductor die;
- a third PCB unit disposed between the substrate and interposer adjacent to a third edge of the first semiconductor die and between the third edge of the first semiconductor die and a third edge of the interposer in plan view, wherein the first semiconductor die is directly between the first PCB unit and third PCB unit;
- and
- an encapsulant deposited between the interposer and substrate, wherein the encapsulant covers a first portion of a first surface of the first semiconductor die while a second portion of the first surface including the photonic portion remains exposed from the encapsulant.
10 more elements
A semiconductor device, comprising:
- an interposer;
- a first semiconductor die disposed over the interposer with a portion of the first semiconductor die extending over a fourth edge of the interposer and outside a footprint of the interposer;
- a first PCB unit disposed over the interposer adjacent to a first edge of the first semiconductor die and between the first edge of the first semiconductor die and a first edge of the interposer in plan view;
- a second PCB unit disposed over the interposer adjacent to a second edge of the first semiconductor die and between the second edge of the first semiconductor die and a second edge of the interposer in plan view, wherein the second edge of the first semiconductor die is perpendicular to the first edge of the first semiconductor die;
- a third PCB unit disposed over the interposer adjacent to a third edge of the first semiconductor die and between the third edge of the first semiconductor die and a third edge of the interposer in plan view, wherein the first semiconductor die is directly between the first PCB unit and third PCB unit;
- a substrate disposed with the first semiconductor die, first PCB unit, second PCB unit, and third PCB unit between the interposer and substrate;
- a first solder bump disposed between the interposer and first PCB unit;
- and
- a second solder bump disposed between the first PCB unit and substrate.
6 more elements
Dependencies are inferred from the claim text.