Red flip chip light emitting diode, package, and method of making the same
AssigneeBridgelux, Inc.
InventorVladimir A. Odnoblyudov
Life of this patent
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AssigneeBridgelux, Inc.
InventorVladimir A. Odnoblyudov
Estimating the term…
Flip chip LEDs comprise a transparent carrier and an active material layer such as AlInGaP bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip LED has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer. Chip-on-board LED packages comprise a plurality of the flip chip LEDs with respective first and second electrical terminals interconnected with one another. The package may include Flip chip LEDs that emit light between 420 to 500 nm, and the flip chip LEDs are covered with a phosphorus material comprising a yellow constituent, and may comprise a transparent material disposed over the phosphorus material.
A flip chip light emitting diode comprising:
A flip chip light emitting diode comprising:
A flip chip light emitting diode comprising:
Dependencies are inferred from the claim text.