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US 12,218,108 B2Granted
Package and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Jie Chen, Ming-Fa Chen
Life of this patent
Estimating the term…
Abstract
A package includes a first die, a second die, and an encapsulant. The first die includes a first capacitor. The second die includes a second capacitor. The second die is stacked on the first die. The first capacitor is spatially separated from the second capacitor. The first capacitor is electrically connected to the second capacitor. The encapsulant laterally encapsulates the second die.
Claims20
A package, comprising:
- a first die comprising a first capacitor;
- a second die comprising a second capacitor, wherein the second die is stacked on the first die, the first capacitor is spatially separated from the second capacitor, and the first capacitor is electrically connected to the second capacitor;
- and
- an encapsulant laterally encapsulating the second die.
1 more element
A package, comprising:
- a first die, comprising:
- a first interconnection structure;
- and
- a second die stacked on the first die, comprising:
- a second interconnection structure;
- a passive device, comprising a first MIM structure and a second MIM structure electrically connected to the first MIM structure, wherein the first MIM structure is embedded in the first interconnection structure, the second MIM structure is embedded in the second interconnection structure, and the first MIM structure comprises a bottom metal layer, an insulating layer, and a top metal layer stacked in sequential order;
- and
- an encapsulant laterally encapsulating the second die.
5 more elements
A manufacturing method of a package, comprising:
- providing a wafer substrate having a first interconnection structure, wherein a first capacitor is formed in the first interconnection structure;
- providing a die having a second interconnection structure, wherein a second capacitor is formed in the second interconnection structure;
- bonding the die to the wafer substrate such that the first capacitor is electrically connected to the second capacitor;
- and
- laterally encapsulating the die by an encapsulant.
2 more elements
Dependencies are inferred from the claim text.