Method for forming chip package structure with molding layer

A method for forming a chip package structure, comprising:

• providing a plurality of chip package units, wherein each of the chip package units comprises a first chip structure, a second chip structure, a first insulating layer, a first molding layer, and a second molding layer, the first molding layer surrounds the first chip structure, the second chip structure is over the first chip structure, the second molding layer surrounds the second chip structure and is over the first molding layer, the first insulating layer is between the first molding layer and the second molding layer and between the first chip structure and the second chip structure, the first insulating layer is made of a first material, the first molding layer is made of a second material, the second molding layer is made of a third material, the first material is different from the second material and the third material, a boundary between the second molding layer and the first insulating layer is connected to a first sidewall of the second molding layer, and the chip package units comprises a first chip package unit, a second chip package unit, and a third chip package unit;
• forming a third molding layer surrounding the first chip package unit, the second chip package unit, and the third chip package unit, wherein a first top surface of the first chip package unit, a second top surface of the second chip package unit, a third top surface of the third chip package unit, and a fourth top surface of the third molding layer are substantially level with each other;
• forming a second insulating layer over the first chip package unit, the second chip package unit, the third chip package unit, and the third molding layer;
• disposing a third chip structure over the second insulating layer, the third molding layer, the first chip package unit and the second chip package unit, wherein the third chip structure overlaps the first chip package unit and the second chip package unit;
• forming a fourth molding layer surrounding the third chip structure, wherein the second insulating layer separates the fourth molding layer from the third molding layer and is in contact with the third chip structure, the first chip package unit, the second chip package unit, and the third chip package unit;
• and
• cutting through the third molding layer, the second insulating layer, and the fourth molding layer, wherein a boundary between the fourth molding layer and the second insulating layer is connected to a second sidewall of the fourth molding layer.

A method for forming a chip package structure, comprising:

• providing a plurality of chip package units, wherein each of the chip package units comprises a first chip structure, a second chip structure, a first molding layer, and a second molding layer, the first molding layer surrounds the first chip structure, the second chip structure is over the first chip structure, the second molding layer surrounds the second chip structure and is over the first molding layer, and the chip package units comprises a first chip package unit, a second chip package unit, and a third chip package unit;
• forming a third molding layer surrounding the first chip package unit, the second chip package unit, and the third chip package unit, wherein a first bottom surface of the first chip package unit, a second bottom surface of the second chip package unit, a third bottom surface of the third chip package unit, and a fourth bottom surface of the third molding layer are substantially level with each other;
• forming an insulating layer over the first chip package unit, the second chip package unit, the third chip package unit, and the third molding layer;
• forming a third chip structure over the insulating layer, the first chip package unit and the second chip package unit;
• forming a fourth molding layer surrounding the third chip structure and over the insulating layer, wherein the insulating layer is made of a first material, the third molding layer is made of a second material, the fourth molding layer is made of a third material, and the first material is different from the second material and the third material;
• and
• cutting through the third molding layer, the insulating layer, and the fourth molding layer, wherein a boundary between the fourth molding layer and the insulating layer is connected to a second sidewall of the fourth molding layer after the fourth molding layer is cut.