Semiconductor package and method of manufacturing semiconductor package

A semiconductor package comprising:

• a package substrate including a first wiring pattern, a second wiring pattern, and a third wiring pattern sequentially stacked from an upper surface of the package substrate, the package substrate having a first insertion hole, a second insertion hole, and a third insertion hole extending from the upper surface of the package substrate into the package substrate to expose portions of the first wiring pattern, the second wiring pattern, and the third wiring pattern in different insulation layers, respectively;
• a semiconductor chip disposed on the package substrate and having a first surface on which chip pads are formed;
• a plurality of connection pins provided on the chip pads, respectively, the plurality of connection pins including a first connection pin, a second connection pin, and a third connection pin extending through the first insertion hole, the second insertion hole, and the third insertion hole to electrically connect to the portions of the first wiring pattern, the second wiring pattern, and the third wiring pattern that are exposed by the first insertion hole, the second insertion hole, and the third insertion hole, respectively;
• and
• a molding member provided on the package substrate to cover the semiconductor chip,
• wherein each of the first insertion hole, the second insertion hole, and the third insertion hole has a first diameter within a range of about 15 μm to about 150 μm, and each of the first connection pin, the second connection pin and the third connection pin has a second diameter within a range of about 5 μm to about 95 μm, the first diameter being greater than the second diameter,
• wherein a first height of the first connection pin from the first surface of the semiconductor chip is greater than a first depth of the first insertion hole from the upper surface of the package substrate, such that the first connection pin physically contacts the portion of the first wiring pattern,
• a second height of the second connection pin from the first surface of the semiconductor chip is greater than a second depth of the second insertion hole from the upper surface of the package substrate, such that the second connection pin physically contacts the portion of the second wiring pattern, and
• a third height of the third connection pin from the first surface of the semiconductor chip is greater than a third depth of the third insertion hole from the upper surface of the package substrate, such that the third connection pin physically contacts the portion of the third wiring pattern,
• wherein each of the first connection pin, the second connection pin and the third connection pin includes a connection pillar provided on the respective chip pad and extending from the first surface of the semiconductor chip and a metal bonding layer provided to cover an entire outer surface of the connection pillar, and
• wherein the metal bonding layers of the plurality of connection pins physically contact and form a thermo-compression bond with the portions of the wiring patterns, respectively, that are exposed by the insertion holes.

A semiconductor package comprising:

• a package substrate;
• a first semiconductor chip disposed on the package substrate, the first semiconductor chip having a first surface on which chip pads are formed;
• a plurality of connection pins provided on the chip pads of the first semiconductor chip, respectively;
• at least one support structure on an upper surface of the package substrate, the at least one support structure being spaced from the first semiconductor chip;
• a plurality of additional semiconductor chips stacked on the package substrate and supported by the at least one support structure;
• and
• a molding member provided on the upper surface of the package substrate to cover the first semiconductor chip, the at least one support structure and the plurality of additional semiconductor chips,
• wherein the package substrate includes wiring patterns provided respectively in a plurality of insulation layers and the package substrate has insertion holes extending from the upper surface of the package substrate into the package substrate to expose portions of the wiring patterns in different insulation layers, respectively, and
• wherein the plurality of connection pins extend through corresponding ones of the insertion holes to electrically connect to the portions of the wiring patterns, respectively, that are exposed by the insertion holes, and
• wherein heights of the plurality of connection pins from the first surface of the semiconductor chip are greater than depths of the corresponding ones of the insertion holes from the upper surface of the package substrate such that the plurality of connection pins physically contact the portions of the wiring patterns that are exposed by the corresponding ones of the insertion holes,
• wherein each of the plurality of connection pins includes a connection pillar provided on the respective chip pad and extending from the first surface of the semiconductor chip and a metal bonding layer provided to cover an entire outer surface of the connection pillar, and
• wherein the metal bonding layers of the plurality of connection pins physically contact and form a thermo-compression bond with the portions of the wiring patterns, respectively, that are exposed by the insertion holes.