Superconducting bump bonds for quantum computing systems
AssigneeGoogle Inc.
InventorsZhimin Jamie Yao, Bob Benjamin Buckley
Life of this patent
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Abstract
A quantum computing system can include a first substrate including one or more quantum control devices. The quantum computing system can include a second substrate including one or more quantum circuit elements. The quantum computing system can include one or more tin contact bonds formed on the first substrate and the second substrate. The tin contact bonds can bond the first substrate to the second substrate. The tin contact bonds can be or can include tin, such as a tin alloy.
Claims16
A method for bonding substrates, the method comprising:
- depositing, on a first substrate, one or more tin bond deposits, the one or more tin bond deposits comprising tin;
- heating the first substrate to a tin contact bond formation temperature;
- and
- pressing the first substrate against a second substrate to form one or more tin contact bonds from the one or more tin bond deposits;
- wherein one of the first substrate or the second substrate comprises one or more qubits and another of the first substrate or the second substrate comprises one or more control devices configured to control the one or more qubits.
A method of bonding substrates, the method comprising:
- depositing, on a first substrate, one or more tin bond deposits, the one or more tin bond deposits comprising tin;
- heating the first substrate to a tin contact bond formation temperature;
- pressing the first substrate against a second substrate to form one or more tin contact bonds from the one or more tin bond deposits;
- depositing, on at least one of the first substrate or a third substrate, one or more second bond deposits, the one or more second bond deposits forming contact bonds at a second contact bond formation temperature, the second contact bond formation temperature being less than a melting point of the one or more tin contact bonds;
- heating the at least one of the first substrate or the third substrate to the second contact bond formation temperature and not exceeding the melting point of the one or more tin contact bonds;
- and
- pressing the first substrate against the third substrate to form one or more second contact bonds from the one or more second bond deposits.
A method for bonding substrates, the method comprising:
- depositing, on a first substrate, one or more tin bond deposits, the one or more tin bond deposits comprising tin;
- heating the first substrate to a tin contact bond formation temperature;
- and
- pressing the first substrate against a second substrate to form one or more tin contact bonds from the one or more tin bond deposits;
- and further comprising:
- coating the one or more tin bond deposits with a capping layer, wherein the capping layer is broken when the first substrate is pressed against the second substrate to form the one or more tin contact bonds.
Dependencies are inferred from the claim text.