Substrate, electronic device, and method for manufacturing substrate

An electronic device, comprising:

• a semiconductor chip;
• an insulating material having a first thermal conductivity;
• a transmission line wired to the insulating material, wherein the transmission line is configured to transmit an electrical signal from the semiconductor chip;
• and
• a wiring layer that includes a heat storage material, wherein
• the transmission line is wired to the wiring layer,
• the heat storage material has a second thermal conductivity,
• the second thermal conductivity is higher than the first thermal conductivity,
• the heat storage material accumulates latent heat based on a phase transition of the heat storage material, and
• the phase transition occurs within an operating temperature range of the semiconductor chip.

A method for manufacturing a substrate, the method comprising:

• disposing, in a wiring layer of the substrate, a heat storage material that has a higher thermal conductivity than an insulating material of the substrate, wherein
• the heat storage material accumulates latent heat based on a phase transition of the heat storage material, and
• the phase transition occurs within an operating temperature range of a semiconductor chip;
• and
• wiring a transmission line to the insulating material, wherein the transmission line transmits an electrical signal from the semiconductor chip.