Package structure

A package structure, comprising:

• an electronic device comprising conductive terminals;
• a buffer cap covering sidewalls of the electronic device, the buffer cap extending over a surface of the electronic device on which the conductive terminals are distributed to laterally encapsulate the conductive terminals;
• a first insulating encapsulation laterally encapsulating the electronic device and the buffer cap;
• and
• an adhesion layer in contact with the electronic device and the buffer cap.

A structure, comprising:

• a first semiconductor die comprising conductive terminals;
• second semiconductor dies stacked over the first semiconductor die, wherein the conductive terminals are spaced apart from the second semiconductor die by the first semiconductor die, and the first semiconductor die is wider than the second semiconductor dies;
• an insulating encapsulation disposed on the first semiconductor die to laterally encapsulate the second semiconductor die, sidewalls of the insulating encapsulation being substantially aligned with sidewalls of the first semiconductor die;
• and
• a buffer cap laterally encapsulating the first semiconductor die and the insulating encapsulation, wherein the buffer cap is wider than the first semiconductor die, wherein the buffer cap comprises:
• a first buffer layer covering a first surface of the first semiconductor die, the sidewalls of the first semiconductor die and upper portions of the sidewalls of the insulating encapsulation;
• and
• a second buffer layer covering bottom portions of the sidewalls of the insulating encapsulation, wherein sidewalls of the first buffer layer substantially align with sidewalls of the second buffer layer.