Package structure with reinforced element

A package structure, comprising:

• a reinforced plate;
• a redistribution structure over the reinforced plate, wherein the redistribution structure comprises a plurality of polymer-containing layers and a plurality of first conductive features;
• an interconnection structure between the reinforced plate and the redistribution structure, wherein the interconnection structure comprises a passivation layer, a plurality of silicon-containing oxide layers, and a plurality of second conductive features, wherein the passivation layer is in direct contact with the redistribution structure;
• a plurality of chip structures bonded to the redistribution structure through a plurality of solder bumps;
• a protective layer surrounding the chip structures;
• and
• a thermal conductive structure directly on the chip structures.

A package structure, comprising:

• a reinforced plate;
• a redistribution structure over the reinforced plate, wherein the redistribution structure comprises a plurality of polymer-containing layers and a plurality of first conductive features;
• an interconnection structure between the reinforced plate and the redistribution structure, wherein the interconnection structure comprises a plurality of silicon-containing oxide layers and a plurality of second conductive features, wherein the interconnection structure is thinner than the redistribution structure;
• a plurality of chip structures bonded to the redistribution structure through a plurality of solder bumps;
• a protective layer surrounding the chip structures;
• and
• a thermal conductive structure extending across opposite edges of the chip structures, wherein the thermal conductive structure is in direct contact with the protective layer.