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US 12,218,077 B2Granted
Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsCheng-Nan Lin, Ming-Chiang Lee, Yung-I Yeh
Life of this patent
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Abstract
A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first electronic component and supported by the support component.
Claims16
A semiconductor device package, comprising:
- a carrier;
- a first electronic component disposed on the carrier;
- a support component disposed on the carrier;
- a second electronic component disposed on the first electronic component and supported by the support component,
- wherein the second electronic component comprises a first set of conductive pads, and the support component and at least one of the first set of conductive pads are overlapping;
- and
- a third electronic component disposed on the second electronic component, wherein the first set of conductive pads are not covered by the third electronic component.
4 more elements
A semiconductor device package, comprising:
- a first carrier;
- a first electronic component disposed on the first carrier;
- a conductive structure disposed on the first carrier;
- a second carrier in contact with the conductive structure;
- and
- a second electronic component disposed on the second carrier;
- and
- a first conductive element extending along a lateral side of second electronic component and electrically connects the second electronic component to the second carrier,
- wherein the second carrier comprises a conductive layer and a dielectric layer covering the conductive layer and contacting the first electronic component, and wherein a first portion of the conductive layer over the first electronic component is physically spaced apart from the first electronic component by the dielectric layer.
6 more elements
A semiconductor device package, comprising:
- a first electronic component;
- a second electronic component disposed on the first electronic component;
- a conductive wire having a first end electrically connecting the second electronic component and a second end electrically connecting the first electronic component;
- a support component supporting the first end;
- and
- a plurality of conductive structures disposed along at least two edges of the first electronic component, and wherein at least one of the plurality of conductive structures is disposed at least partially under the second end.
3 more elements
Dependencies are inferred from the claim text.