Package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsCheng-Yuan Kung, Hsu-Chiang Shih, Hung-Yi Lin, Chien-Mei Huang
Life of this patent
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Abstract
A package structure includes an encapsulant, a patterned circuit structure, at least one electronic component and a shrinkage modifier. The patterned circuit structure is disposed on the encapsulant and includes a pad. The electronic component is disposed on the patterned circuit structure, and includes a bump electrically connected to the pad. The shrinkage modifier is encapsulated in the encapsulant and configured to reduce a relative displacement between the bump and the pad along a horizontal direction in an environment of temperature variation.
Claims18
A package structure, comprising:
- an encapsulant;
- a patterned circuit structure disposed on the encapsulant, and including a pad;
- at least one electronic component disposed on the patterned circuit structure, and including a bump electrically connected to the pad;
- and
- a shrinkage modifier encapsulated in the encapsulant and configured to reduce a relative displacement between the bump and the pad along a horizontal direction in an environment of temperature variation, wherein a coefficient of thermal expansion of the shrinkage modifier is less than a coefficient of thermal expansion of the patterned circuit structure and a coefficient of thermal expansion of the encapsulant.
A package structure, comprising:
- an interposer;
- a plurality of electronic components disposed above the interposer and electrically communicating with each other through the interposer;
- and
- a decoupling structure electrically connected to the electronic components through the interposer, wherein the interposer has a power region and a bridge region, the electronic components electrically communicate with each other through the bridge region, and the decoupling structure is disposed closer to the power region than to the bridge region.
A package structure, comprising:
- an encapsulant having a bridge region, a power region around the bridge region, and a signal region around the power region;
- a bridge interposer encapsulated in the encapsulant, and disposed in the bridge region and the power region of the encapsulant, wherein the bridge interposer comprises a first conductive structure disposed in the bridge region of the encapsulant and a second conductive structure disposed in the power region of the encapsulant, and a circuit density of the first conductive structure is greater than a circuit density of the second conductive structure;
- and
- a plurality of conductive pillars disposed in the signal region of the encapsulant, wherein the circuit density of the second conductive structure is greater than a circuit density of the conductive pillars.
Dependencies are inferred from the claim text.