Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers

A package, comprising:

• a first die having a first plurality of die pads;
• a second die having a second plurality of die pads, the second die laterally spaced apart from the first die;
• a molding layer laterally surrounding the first die, the second die, the first plurality of die pads and the second plurality of die pads, the molding layer having an uppermost surface at a same level as an uppermost surface of the first plurality of die pads and the second plurality of die pads;
• a first plurality of conductive vias, wherein individual ones of the first plurality of conductive vias are on a corresponding one of the first plurality of die pads, the first plurality of conductive vias having an uppermost surface;
• a second plurality of conductive vias, wherein individual ones of the second plurality of conductive vias are on a corresponding one of the second plurality of die pads, the second plurality of conductive vias having an uppermost surface, wherein one of the second plurality of conductive vias is electrically coupled to one of the first plurality of conductive vias;
• a first plurality of conductive traces on the uppermost surface of the molding layer over the first die, the first plurality of conductive traces having an uppermost surface below the uppermost surface of the first plurality of conductive vias;
• and
• a second plurality of conductive traces on the uppermost surface of the molding layer over the second die, the second plurality of conductive traces having an uppermost surface below the uppermost surface of the second plurality of conductive vias.

A package, comprising:

• a die having a plurality of die pads;
• a molding layer laterally surrounding the die and the plurality of die pads, the molding layer having an uppermost surface at a same level as an uppermost surface of the plurality of die pads;
• a plurality of conductive vias, wherein individual ones of the plurality of conductive vias are on a corresponding one of the plurality of die pads, the plurality of conductive vias having an uppermost surface;
• a plurality of conductive traces on the uppermost surface of the molding layer over the die, the plurality of conductive traces having an uppermost surface below the uppermost surface of the plurality of conductive vias;
• and
• a dielectric layer above the die and the molding layer, the dielectric layer over the plurality of conductive traces, and the dielectric layer having an uppermost surface at a same level as the uppermost surface of the plurality of conductive vias.