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US 12,218,063 B2Granted
EMIB architecture with dedicated metal layers for improving power delivery
AssigneeIntel Corporation
InventorsJianyong Xie, Sujit Sharan, Huang-Ta Chen
Life of this patent
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Abstract
Embodiments disclosed herein include electronic packages with a bridge that comprise improved power delivery architectures. In an embodiment, a bridge comprises a substrate and a routing stack over the substrate. In an embodiment, the routing stack comprises first routing layers, where individual ones of the first routing layers have a first thickness, and a second routing layer, where the second routing layer has a second thickness that is greater than the first thickness.
Claims23
A bridge, comprising:
- a silicon substrate;
- a routing stack over the silicon substrate, wherein the routing stack comprises:
- a first routing layer, wherein the first routing layer has a first thickness;
- a second routing layer, wherein the second routing layer has a second thickness that is greater than the first thickness;
- and
- a third routing layer having the first thickness, wherein the second routing layer is vertically between the first routing layer and the third routing layer.
3 more elements
An electronic package, comprising:
- a package substrate;
- a bridge embedded in the package substrate, wherein the bridge comprises:
- a silicon substrate;
- a routing stack over the silicon substrate, wherein the routing stack comprises a first routing layer with a first thickness and a second routing layer with a second thickness and a third routing layer with the first thickness, wherein the second thickness is greater than the first thickness, and wherein the second routing layer is vertically between the first routing layer and the third routing layer;
- a first die electrically coupled to the bridge;
- and
- a second die electrically coupled to the bridge, wherein the first die is electrically coupled to the second die by the first routing layer.
4 more elements
An electronic system, comprising:
- a board;
- a package substrate attached to the board;
- a bridge embedded in the package substrate, wherein the bridge comprises at least five routing layers above a silicon substrate, and wherein at least one of the routing layers has a first thickness that is greater than a second thickness of other routing layers, the at least one of the routing layers vertically between a first one and a second one of the other routing layers;
- a first die coupled to the bridge;
- and
- a second die coupled to the bridge, wherein the first die is electrically coupled to the second die by one or more of the routing layers.
3 more elements
Dependencies are inferred from the claim text.