Semiconductor structure and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJen-Yuan Chang, Chia-Ping Lai
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Abstract
A semiconductor structure and a method for forming the semiconductor structure are disclosed. The semiconductor structure includes: a first die including: a fuse structure including a pair of conductive segments, wherein the pair of conductive segments are separated by a void and one of the pair of conductive segments is electrically connected to a bonding pad of the first die; and a second die over and bonded to the first die, the second die including an inductor electrically connected to the one of the pair of conductive segments.
Claims20
A semiconductor structure comprising:
- a first die comprising a fuse structure including a pair of conductive segments, wherein the pair of conductive segments are separated by a void and one of the pair of conductive segments is electrically connected to a bonding pad of the first die, wherein the bonding pad is electrically connected to ground;
- and
- a second die over and bonded to the first die, the second die including an inductor electrically connected to the one of the pair of conductive segments.
A semiconductor structure comprising:
- a first integrated circuit component comprising a fuse structure, the fuse structure being in a blown state;
- a second integrated circuit component bonded to the first integrated circuit component, the second integrated circuit component comprising an inductor electrically connected to the fuse structure;
- and
- a third integrated circuit component bonded to the second integrated circuit component and electrically connected to the first integrated circuit component,
- wherein the first integrated circuit component further comprises a bonding layer electrically bonding the first integrated circuit component to the second integrated circuit component, wherein the fuse structure is arranged within the bonding layer.
A semiconductor structure comprising:
- a first integrated circuit component comprising a first fuse structure;
- a second integrated circuit component arranged over the first integrated circuit component and comprising an inductor;
- and
- a third integrated circuit component arranged over and bonded to the second integrated circuit component, the third integrated circuit component comprising a second fuse structure,
- wherein the first integrated circuit component comprises a seal ring, and the first fuse structure is electrically connected to ground through the seal ring.
Dependencies are inferred from the claim text.