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US 12,218,030 B2Granted
Electronic module comprising a semiconductor package with integrated clip and fastening element
AssigneeInfineon Technologies Austria AG
InventorsEdward Fuergut, Peter Eibl, Horst Groeninger, Martin Gruber, Christian Kasztelan, Philipp Seng
Life of this patent
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Abstract
An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heat sink.
Claims2
An electronic module, comprising:
- a semiconductor package;
- a clip connected to the semiconductor package, the clip comprising at least one fastening element which is configured to make a connection to an external heatsink;
- and
- wherein the semiconductor package comprises a semiconductor die and an encapsulant of electrically insulating material that encapsulates the semiconductor die,
- wherein a portion of the clip is completely embedded in the encapsulant,
- wherein the clip is electrically isolated from the semiconductor die by a portion of the encapsulant, and
- wherein the at least one fastening element is a curved bend in the clip that is dimensioned such that an end portion of the clip comprising the curved bend can be securely retained within a bulge of a trench in the external heatsink.
4 more elements
Dependencies are inferred from the claim text.