Semiconductor package and method of forming the same

A semiconductor package, comprising:

• a redistribution structure;
• a first semiconductor device disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device comprises a first portion and a second portion stacking on the first portion along a first direction, the first portion has a first side surface, the second portion has a second side surface, a slope of the first side surface is different from a slope of the second side surface, a first surface of the first portion connects with the first side surface and is a bottom surface of the first semiconductor device, a second surface of the second portion connects with the second side surface and is a top surface of the first semiconductor device, a first obtuse angle is between first side surface and the first surface, and a first acute angle is between the second side surface and the second surface;
• a second semiconductor device disposed aside the first semiconductor device and electrically connected with the redistribution structure, wherein the second semiconductor device comprises a third portion and a fourth portion stacking on the third portion along the first direction, the third portion has a third side surface, the fourth portion has a fourth side surface, a space is between the first semiconductor device and the second semiconductor device and is sandwiched by the first side surface, the second side surface, the third side surface and the fourth side surface, a slope of the third side surface is different from a slope of the fourth side surface, a third surface of the third portion connects with the third side surface and is a bottom surface of the second semiconductor device, a fourth surface of the fourth portion connects with the fourth side surface and is a top surface of the second semiconductor device, a second obtuse angle is between third side surface and the third surface, and a second acute angle is between the fourth side surface and the fourth surface;
• an underfill layer filling the space between the first semiconductor device and the second semiconductor device;
• and
• an encapsulant encapsulating the first semiconductor device, the second semiconductor device and the underfill layer.

A method of forming a semiconductor package comprising:

• providing a first semiconductor device with a first side surface connecting with a first bottom surface and a first top surface, wherein the first side surface comprises a first sub-surface and a second sub-surface, the first sub-surface is connected with the first bottom surface, the second sub-surface is connected with the first top surface, a first obtuse angle is between the first sub-surface and the first bottom surface, and a first acute angle is between the second sub-surface and the first top surface;
• providing a second semiconductor device with a second side surface connecting with a second bottom surface and a second top surface, wherein the second side surface comprises a third sub-surface and a fourth sub-surface, the third sub-surface is connected with the second bottom surface, the fourth sub-surface is connected with the second top surface, a second obtuse angle is between the third sub-surface and the second bottom surface, and a second acute angle is between the fourth sub-surface and the second top surface;
• forming a redistribution structure;
• bonding the first semiconductor device and the second semiconductor device to the redistribution structure to have the first side surface facing toward the second side surface;
• forming an underfill layer between the first semiconductor device and the second semiconductor device, between the first semiconductor device and the redistribution structure, and between the second semiconductor device and the redistribution structure;
• and
• encapsulating the first semiconductor device, the second semiconductor device and the underfill layer by an encapsulant.