Passivation structure with planar top surfaces
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Hsiu Chen, Wen-Chih Chiou, Chen-Hua Yu
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Abstract
A method includes forming a first passivation layer, forming a metal pad over the first passivation layer, forming a planarization layer having a planar top surface over the metal pad, and patterning the planarization layer to form a first opening. A top surface of the metal pad is revealed through the first opening. The method further includes forming a polymer layer extending into the first opening, and patterning the polymer layer to form a second opening. The top surface of the metal pad is revealed through the second opening.
Claims20
A structure comprising:
- a metal pad;
- a passivation layer, with a portion of the passivation layer overlapping a part of the metal pad;
- a planarization layer comprising a planar top surface, wherein the planar top surface comprises:
- a first part overlapping the metal pad;
- and
- a second part vertically offset from the metal pad;
- a polymer layer comprising:
- a first portion overlapping the planarization layer;
- and
- a second portion extending into the planarization layer and the passivation layer to contact the metal pad;
- and
- a conductive feature in the polymer layer to contact the metal pad.
A structure comprising:
- a metal pad;
- a first passivation layer on a sidewall and a top surface of the metal pad, wherein the first passivation layer comprises a first edge;
- a planarization layer over the first passivation layer, wherein the planarization layer comprises a second edge continuously joined to the first edge;
- and
- a polymer layer comprising:
- an upper portion over the planarization layer;
- and
- a lower portion in the planarization layer and the first passivation layer to contact the metal pad, wherein the lower portion contacts both of the first edge and the second edge.
A structure comprising:
- a first passivation layer;
- a conductive feature comprising a conductive via extending into the first passivation layer, and a conductive pad over the first passivation layer;
- a second passivation layer comprising a portion over the conductive feature;
- a planarization layer over the second passivation layer;
- and
- a polymer layer comprising a portion over and contacting the conductive pad, wherein the polymer layer contacts both of the second passivation layer and the planarization layer.
Dependencies are inferred from the claim text.