Semiconductor packages

A semiconductor package, comprising:

• a first redistribution layer comprising a first insulating layer;
• a connector and a first die encapsulated by a first encapsulant over the first redistribution layer;
• a second redistribution layer over the first encapsulant and comprising a second insulating layer and a plurality of first conductive patterns in the second insulating layer;
• and
• a second die over the second redistribution layer, electrically connected to the first die, wherein the first encapsulant comprises a molding compound, a material of each of the first insulating layer and the second insulating layer is not the molding compound, top surfaces of a plurality of second conductive patterns of the first die are coplanar with top surfaces of the first encapsulant and the connector, and sidewalls of the first redistribution layer, the second redistribution layer and the first encapsulant are substantially flush.

A semiconductor package, comprising:

• a first redistribution layer comprising a plurality of first insulating layers and a plurality of first conductive patterns in the first insulating layers;
• a second redistribution layer over the first redistribution layer, comprising a plurality of second insulating layers and a plurality of second conductive patterns in the second insulating layers;
• and
• a first encapsulant, a bus die and a plurality of through vias, disposed between the first redistribution layer and the second redistribution layer, wherein the first encapsulant comprises a molding compound, top surfaces of a plurality of third conductive patterns of the bus die are coplanar with top surfaces of the first encapsulant and the plurality of through vias, and sidewalls of the first insulating layers, the second insulating layers and the first encapsulant are substantially flush, and the second conductive patterns are bonded to conductive connectors of a die through solder regions.